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化學機械研磨製程中藉由偵測研磨界面溫度檢測研磨墊使用狀況及壽命的方法「Method of monitoring surface status and life of pad by detecting temperature of polishing interface during chemical mechanical process」

專利國別: 美國  瀏覽人次: 14  發表日期: 2012-06-22 09:44:25  最後修改: 2017-12-06 14:20:19

項目 內容
專利讓與

一、依據科技部中華民國105年12月21日科部產字第1050096603號函辦理

二、公告日:2017年12月06日(星期三)

三、公告讓與期間:自公告日起3個月。

四、敬請有興趣辦理受讓之廠商,或對受讓申請程序有任何疑問者,聯繫研發處技術推廣中心洽談,電話:05-27204111650116504

本校案號 P93013A
發明人 鄭友仁、黃培堯
所屬院 工學院
所屬系所 機械工程學系所
類型 發明
申請號 11/228,219
申請日期 2005-09-19
公開號 US 2007-0008023 A1
公開日期 2007-01-11
證書號 US7,169,019B2
核准日期 2007-01-30
國際分類號 B24B1/00
專利權期間 2005.09.19~2025.09.18
專利摘要 A method of monitoring surface status and life of a pad by detecting temperature of a polishing interface during a CMP process. The method include the steps of preparing and placing a brand-new pad under an artificially controlled environment for several CMP tests until termination of its operational life to conclude a relationship between the last stable temperature-rise at a polishing trace during the CMP process and surface roughness of the pad. Then conducting a polishing test of a subject pad under an artificially controlled environment to conclude a relationship between the last stable temperature-rise at a polishing trace during the CMP process and surface roughness of the subject pad. Comparing the two relationships indicated in the aforesaid two steps for analysis to monitor the surface status and operational life of the subject pad.
專利權人 國立中正大學

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