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專利國別 |
美國 |
發表日期 |
2014-08-14 10:34:03 |
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本校案號 |
P95012A |
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專利名稱 |
低應力拋光裝置「LOW-STRESS POLISHING DEVICE」 |
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發明人 |
蔡孟勳、鄭友仁 |
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所屬院 |
工學院 |
提案單位 |
機械工程學系暨研究所 |
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類型 |
發明 |
專利權人 |
國立中正大學 |
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申請號 |
12/071,423 |
申請日期 |
2008-02-21 |
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公開號 |
US 2008-0287045 A1 |
公開日期 |
2008-11-20 |
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證書號 |
US 7,695,351 B2 |
核准日期 |
2010-03-13 |
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國際分類號 |
B24B-007/00(2006.01) |
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專利權期間 |
2008.02.21~2028.02.21 |
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專利摘要 |
A low-stress polishing device includes a base;a plurality of actuators mounted to the base and spaced from each other in a predetermined interval,each of the actuators having a drive shaft and a buffer spring connected with the drive shaft for providing the drive shaft with a predetermined impulsive pressure,each of the drive shafts having a buffer pad located at a distal end thereof;at least one drive circuit electrically connected with the actuators for control of driving the actuators;a working plate mounted to the buffer pads;and a polishing pad mounted to the working plate.Accordingly,the vibration mode generated by the device provides a dynamic pressure on the wafer surface for destroying the chemical product on the wafer surface and is applicable to polishing of low-dielectric integrated copper structures. |
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圖示 |
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