專利國別

  美國   

發表日期

2012-06-22 09:45:18

本校案號

P92011A

專利名稱

一種應用薄膜鍍著於半導體銅銲墊晶片表面而實現金線與銅銲墊熱音波銲線接合的方法「METHOD OF REALIZING THERMOSONIC WIRE BONDING BETWEEN METAL WIRES AND COPPER PADS BY DEPOSITING A THIN FILM TO SURFACE OF SEMICONDUCTOR CHIP WITH COPPER PADS」

發明人

敖仲寧、莊正利

所屬院

工學院

提案單位

機械工程學系暨研究所

類型

發明

專利權人

國立中正大學

申請號

11/180,448

申請日期

2005-07-13

公開號

0

公開日期

2007-01-18

證書號

US 7,326,640 B2

核准日期

2008-02-05

國際分類號

H01L-021/44(2006.01)；B23K-031/00(2006.01)；B23K-031/02(2006.01)

專利權期間

2005.07.13~2025.07.13(延長299天至2026.05.08)

專利摘要

Disclosed is a method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surfaces of semiconductor chips with copper pads, where a thin film that provides the effect of self-passivation to prevent oxidization of the copper pads located thereunder is deposited on surfaces of the copper pads to provide sufficient protection to the chips with copper pads thereby preventing copper from oxidizing at elevated temperature during packaging, due to die sawing, die mounting or curing and thermosonic wire bonding, which would result in failure of bonding metal wires to the copper pads, poor bondability between the metal wires and the copper pads, or low bonding strength of the bonds. By selecting a thin film consisting of an appropriate material to be deposited on the surfaces of copper pads for an appropriate thickness would allow conducting the die sawing, die bonding and thermosonic wire bonding within the packing process under the atmosphere, while successful bonding of the metal balls to the chips with copper pads with perfect bondability and sufficient bonding strength meeting the specifications required by the industry.

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