【專利核准公告】P91001A-具銅導線晶片之銲線製程方法「METHOD OF THERMOSONIC WIRE BONDING PROCESS FOR COPPER CONNECTION IN A CHIP」(已終止維護)
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專利國別 |
美國 |
發表日期 |
2012-06-22 09:48:08 |
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本校案號 |
P91001A |
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專利名稱 |
具銅導線晶片之銲線製程方法「METHOD OF THERMOSONIC WIRE BONDING PROCESS FOR COPPER CONNECTION IN A CHIP」 |
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發明人 |
鄭友仁、王章銘 |
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所屬院 |
工學院 |
提案單位 |
機械工程學系暨研究所 |
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類型 |
發明 |
專利權人 |
國立中正大學 |
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申請號 |
10/340,756 |
申請日期 |
2003-01-13 |
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公開號 |
0 |
公開日期 |
2004-06-10 |
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證書號 |
US 6,886,735 B2 |
核准日期 |
2005-05-03 |
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國際分類號 |
B23K-020/00(2006.01)；B23K-020/10 (2006.01)；B23K-031/00(2006.01)；H01L-023/48(2006.01)；H01L-023/485(2006.01) |
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專利權期間 |
2003.01.13~2023.01.13(延長131天至2023.05.24) |
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專利摘要 |
A method of thermosonic wire bonding process for copper connection in a chip comprises controllable time, controllable temperature, and controllable humidity in an artificial circumstance, which generates copper oxide film on a surface of copper chip. The thickness of the film is in the range of 8050 .ANG. to 8200 .ANG.. Therefore, this invention provides the thermosonic wire bonding process for improvement of efficiency and quality. |
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圖示 |
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